Breaking the Bandwidth Barrier: Enabling Celestial AI’s Photonic Fabric™ with Custom ESD IP on TSMC’s 5nm Platform
As AI workloads scale exponentially, bandwidth has become the new bottleneck. This article explores how Celestial AI’s Photonic Fabric™ redefines interconnect performance, and how Sofics’ low-cap ESD and power clamp IP enabled its integration on TSMC’s 5nm platform. A deep dive into real silicon innovation from the TSMC OIP Forum stage.
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