New opportunities for automotive LIN interfaces

Due to the semiconductor shortage in 2021 everyone realized that cars these days integrate a lot of electronics. The average number of computer chips per car has increased a lot in the last decade.

It is clear that the new applications require high-speed interconnects that are not possible with the initial, low-speed interface types. But there is also innovation possible for the old interface types like LIN/CAN by combining it together with other IP blocks on a single die.

3 approaches to handle EOS ‘requirements’

EOS, or Electrical Overstress, is any electrical stress that exceeds any of the specified absolute maximum ratings (AMR) of a product.

It is important to discuss because many products are damaged this way.

This article includes case studies and 3 approaches to handle those requests.

Optimized on-chip ESD protection to enable high-speed Ethernet in cars.

In the past most Electronic Control Units (ECU) used CAN and LIN interfaces to connect to sensors, actuators and each other. However, the newest applications need (much) faster communication options. Gigabit automotive ethernet is pushed by many in the industry as the perfect solution.

With its local ESD clamp approach, Sofics provides the best solution to protect those high-speed chip interfaces against Electrostatic Discharge events.