New opportunities for automotive LIN interfaces

Due to the semiconductor shortage in 2021 everyone realized that cars these days integrate a lot of electronics. The average number of computer chips per car has increased a lot in the last decade.

It is clear that the new applications require high-speed interconnects that are not possible with the initial, low-speed interface types. But there is also innovation possible for the old interface types like LIN/CAN by combining it together with other IP blocks on a single die.

Selecting optimized ESD protection for CMOS image sensors

Today, you can find CMOS image sensors almost everywhere in consumer, automotive, health and security applications. There has been a lot of innovation to enable demanding requirements.

The article provides a summary about the 3 main aspects that IC designers need to consider when selecting the ESD protection clamps for their image sensor projects.

3 approaches to handle EOS ‘requirements’

EOS, or Electrical Overstress, is any electrical stress that exceeds any of the specified absolute maximum ratings (AMR) of a product.

It is important to discuss because many products are damaged this way.

This article includes case studies and 3 approaches to handle those requests.