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EOS protection characterization using Long-Pulse TLP
Why ESD Co-Design is Essential for Next-Gen ICs
New opportunities for automotive LIN interfaces
3 approaches to handle EOS ‘requirements’
Time to say farewell to the snapback ggNMOS for ESD protection
ESD clamps for high voltage, BCD processes
Applying System level ESD (IEC 61000-4-2) stress on ICs
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